proving and laying mm dia, delhi (delhi) , deadline is 09 oct 2026
| proving and laying 450 mm dia new sewer line by hdd trenchless method near telephone exchange dilshad garden in ward no. 217 ac 62 shahdara under ee(c)-08 nit no. 31 (2026-2027) | |
| Deadline | 09 oct 2026 |
| Tenders Location | delhi |
| Tenders Value | 1.29 Crore |
| Document Cost | Refer Document |
| Tender categeory | computer software, hardware |
| Our Ref. ID | 2609214233130 |
| Download Tender Document | |
